Transferable Manufacturing Process Development for HDLW FPAs

This contract involves the development of a scalable and transferable manufacturing process designed to convert non-specification focal plane arrays (FPAs) into focal plane arrays compliant with high-density large wafer (HDLW) standards. The core technology focuses on employing direct bonding techniques to achieve this transition, which is critical for improving the performance and reliability of FPAs used in advanced sensing and imaging applications. The contract is a subcontract issued by the Department of Defense under NAICS code 334418, covering semiconductor manufacturing services. The work is to be performed at Fort Belvoir, with the principal objective of creating a process that can be easily transferred and scaled for broader manufacturing use. This initiative supports enhanced production capabilities in defense-related technologies, emphasizing precision and quality improvements in focal plane array fabrication.