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Transferable Manufacturing Process Development for HDLW FPAs

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This contract involves the development of a scalable and transferable manufacturing process designed to convert non-specification focal plane arrays (FPAs) into focal plane arrays compliant with high-density large wafer (HDLW) standards. The core technology focuses on employing direct bonding techniques to achieve this transition, which is critical for improving the performance and reliability of FPAs used in advanced sensing and imaging applications. The contract is a subcontract issued by the Department of Defense under NAICS code 334418, covering semiconductor manufacturing services. The work is to be performed at Fort Belvoir, with the principal objective of creating a process that can be easily transferred and scaled for broader manufacturing use. This initiative supports enhanced production capabilities in defense-related technologies, emphasizing precision and quality improvements in focal plane array fabrication.

General Info

Develop scalable manufacturing process using direct bonding to upgrade non-spec FPAs to HDLW standards.

Agency

Department Of Defense → W6QK Acc-Apg

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Fort Belvoir, VA, USA

Set-Aside

NONE

Documents

This scope was carved out of W56KGU26CA004.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays

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Timeline

PostedMay 27

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → W6QK Acc-Apg

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → W6QK Acc-Apg

Office AddressN/A

ContactsNo contact information available

Full Description

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Develop a scalable, transferable process to convert non-spec FPAs into HDLW-compliant FPAs using direct bonding techniques.

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