This Combined Synopsis/Solicitation opportunity from Department Of Defense was posted on January 31, 2025. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Wafer Grinder and CMP Tools

Closed

N0017325QMB04Federal

Submission Closed02/14/2025, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 333242

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Solicitation # Doc2441528264

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8 days ago

DEADLINE

in 3 days

AI Contract Overview

The contract involves the procurement of wafer grinders and chemical-mechanical planarization (CMP) tools, with the solicitation open to both new and refurbished hardware options. Offerors are required to specify whether they are proposing new equipment or refurbished units. The solicitation, issued by the Naval Research Laboratory under the Department of Defense, is a total small business set-aside under NAICS code 333242, emphasizing opportunities for small businesses. The response deadline has been extended to February 14, 2025, giving interested contractors additional time to submit their proposals. The contract aims to support the Department of Defense’s research and development efforts in advanced manufacturing equipment, with the primary location of performance in Washington, DC. The designated point of contact for inquiries is Michael Broomfield, reachable via email or phone.

General Info

Procurement of wafer grinding and CMP tools for NRL, bids due February 14, 2025.

Agency

Department Of Defense → Naval Research Laboratory

NAICS

333242 - Semiconductor Machinery Manufacturing

Place of Performance

Washington, DC, 20375, USA

Set-Aside

SBA

Documents

N0017325QMB04 Attachment 1 Wafer Grinder and CMP Tool Specifications

1 page · specifications

High

N00173 25 Q-MB 04 Wafer Grinder and CMP Tool RFQ

33 pages · rfq

High

AI Contract Breakdown

Uniform Contract Format

Contract not broken down yet

CLEATUS splits the solicitation into Uniform Contract Format (UCF) sections: scope, pricing, deliverables, and evaluation criteria.

Timeline

4 updates

PhaseClosed

PostedJan 23

Combined Synopsis

Notice updatedJan 23

Response deadline changed from Feb 7, 2025 to Feb 14, 2025. The notice description changed.

Notice updatedJan 28

The notice description changed.

Notice updatedJan 30

The notice description changed.

Notice updatedJan 31

The notice description changed.

Response DeadlineFeb 14

Deadline has passed

Submission Closed

02/14/2025, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Naval Research Laboratory

Contacts1 person available

OfficeWASHINGTON, DC, 20375-5328, USA

Organization / AgencyDepartment Of Defense → Naval Research Laboratory

Office AddressWASHINGTON, DC, 20375-5328, USA

Contacts

Michael Broomfield

contact@example.gov

+1 (555) 000-0000

Full Description

See attached combined Synopsis/Solicitation and System Specifications. Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished. Amendment #1 extends the due date for receipt of offers from 2/7/2025 to 2/14/2025 Amendment #2 responds to a question and posts a revised combined Synopsis/Solicitation changing the due date for offers to 2/14/2025. Q. Regarding the RFQ for grind and CMP tools for Silicon Carbide - does the NRL intend to provide wafers for potential contractors to perform demonstrations, or are you just looking for data from previous demonstrations? R. NRL will provide wafers for potential contractors to perform the demonstrations. Amendment # 3 respond to following questions: Q. Is NRL looking for automated functions or semi-automatic? Is the purpose for R&D or production? A. Semi-automatic functions are acceptable. The purpose of the tools is for R&D. Q. Few machines automatically move from coarse grind to fine grind. Does NRL require high production or are they looking to do wafers one at a time? A. One wafer at a time. Amendment #4 Respond to questions; For bonded wafers, what is the incoming total wafer stack thickness? Our standard thickness gauge can measure up to 1,800um. If the wafer it thicker than that, we can upgrade to 2.7mm IPG. A. The total wafer stack thickness will be approx. 700 - 750 um SiC wafers have Si plane and C plane. If you could confirm which side to grind/polish, Which plane (Si or C plane) will you polish? In answer to 1 and 2 above with regard to single SiC wafers: For single SiC wafers, the Si- and/or C-planes will need to be ground and/or polished in order to achieve the bow and TTV specs b) For bonded SiC/SiO2/Si stacks, the C-face of the SiC wafer will be ground and polished c) For bonded SiC/SiO2/SiC stacks, the exterior faces will be C-plane and at least one face will need to be ground and polished. The other SiC surface may need to be ground/polished in order to meet the bow and TTV specs Are wafers single crystal or polycrystal? Single crystal Just for confirmation a multi-stage filtration system shall filter particles up to 0.1 ?m in the waste water from the grinding tool at flow rates up to 12 gpm " in the Specifications => This is waste water from the grinder, correct? Yes, correct, the waste water is from the grinder