DISCO HI-TEC AMERICA, INC
DISCO HI-TEC AMERICA, INC is a federal contractor, registered under UEI M94NF1YCNLC6 and CAGE code 1JY39. It has been awarded $1,850,264 in federal contracts. Primary work spans Semiconductor Machinery Manufacturing, Analytical Laboratory Instrument Manufacturing, and Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology). Top awarding agencies include Department Of Defense, Department Of Commerce, and Department Of Defense (dod).
Contact Information
Registration and classification details
Registration
UEI Code
M94NF1YCNLC6CAGE Code
1JY39Entity Structure
Corporate Entity (Not Tax Exempt)Established
N/ABusiness Classifications
NAICS Codes
Federal Contracting Overview
Award totals, agency breakdown, NAICS distribution, and geographic footprint.
AI Capability Profile
DISCO HI-TEC AMERICA, INC specializes in the design, integration, and support of high-precision semiconductor manufacturing equipment, with a demonstrated focus on automated dicing saw systems and water recycling technologies for wafer processing. Their technical expertise lies in precision mechanic...
DISCO HI-TEC AMERICA, INC specializes in the design, integration, and support of high-precision semiconductor manufacturing equipment, with a demonstrated focus on automated dicing saw systems and water recycling technologies for wafer processing. Their technical expertise lies in precision mechanical engineering, process automation, and closed-loop fluid management systems critical to semiconductor fabrication. The company delivers turnkey solutions that enhance yield, reduce contamination, and improve sustainability in cleanroom environments, leveraging advanced motion control, laser alignment, and real-time process monitoring to meet the stringent demands of advanced node manufacturing. Their specialization in water recycling systems reflects a strong commitment to resource efficiency and environmental compliance in high-volume semiconductor production. The contractor has delivered capabilities directly to the Department of Defense, supporting defense-critical semiconductor supply chain initiatives through the provision of mission-ready dicing and wafer processing infrastructure. This engagement suggests alignment with DoD programs requiring secure, domestic manufacturing of microelectronics for defense systems, including radar, avionics, and secure communications hardware. Their primary industry focus is Semiconductor Machinery Manufacturing (NAICS 333242), where they operate as a niche supplier of specialized capital equipment essential to front-end wafer fabrication. This positions them within the advanced electronics manufacturing ecosystem, serving defense, aerospace, and high-reliability commercial semiconductor producers who require precision, repeatability, and process control beyond standard industrial equipment. DISCO HI-TEC AMERICA, INC is structured as a 2L entity headquartered in San Jose, California, placing it at the heart of the global semiconductor innovation corridor. While no federal certifications are disclosed, their geographic location and contract history indicate a strategic alignment with U.S. government initiatives to strengthen domestic semiconductor production capacity. The company’s market positioning is that of a technical specialist providing mission-critical equipment to high-assurance manufacturing environments.
Key Performance Metrics
Awards Count
21
All time
Active
1
Currently performing
Completed
20
Past period of performance
Total Awards
All time
Contracts
Prime · all time
Subcontracts
Sub · all time
Grants
Prime · all time
Subgrants
Sub · all time
Award Analytics & Distribution
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