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DISCO HI-TEC AMERICA, INC

Subsidiary ofDISCO CORPORATIONUEI: M94NF1YCNLC6CAGE: 1JY39

DISCO HI-TEC AMERICA, INC is a federal contractor, registered under UEI M94NF1YCNLC6 and CAGE code 1JY39. It has been awarded $1,850,264 in federal contracts. Primary work spans Semiconductor Machinery Manufacturing, Analytical Laboratory Instrument Manufacturing, and Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology). Top awarding agencies include Department Of Defense, Department Of Commerce, and Department Of Defense (dod).

Contact Information

Registration and classification details

Registration

UEI Code

M94NF1YCNLC6

CAGE Code

1JY39

Entity Structure

Corporate Entity (Not Tax Exempt)

Established

N/A

Business Classifications

For Profit Organization

NAICS Codes

333242Semiconductor Machinery Manufacturing(Primary)
423830Industrial Machinery and Equipment Merchant Wholesalers

Federal Contracting Overview

Award totals, agency breakdown, NAICS distribution, and geographic footprint.

AI Capability Profile

DISCO HI-TEC AMERICA, INC specializes in the design, integration, and support of high-precision semiconductor manufacturing equipment, with a demonstrated focus on automated dicing saw systems and water recycling technologies for wafer processing. Their technical expertise lies in precision mechanic...

DISCO HI-TEC AMERICA, INC specializes in the design, integration, and support of high-precision semiconductor manufacturing equipment, with a demonstrated focus on automated dicing saw systems and water recycling technologies for wafer processing. Their technical expertise lies in precision mechanical engineering, process automation, and closed-loop fluid management systems critical to semiconductor fabrication. The company delivers turnkey solutions that enhance yield, reduce contamination, and improve sustainability in cleanroom environments, leveraging advanced motion control, laser alignment, and real-time process monitoring to meet the stringent demands of advanced node manufacturing. Their specialization in water recycling systems reflects a strong commitment to resource efficiency and environmental compliance in high-volume semiconductor production. The contractor has delivered capabilities directly to the Department of Defense, supporting defense-critical semiconductor supply chain initiatives through the provision of mission-ready dicing and wafer processing infrastructure. This engagement suggests alignment with DoD programs requiring secure, domestic manufacturing of microelectronics for defense systems, including radar, avionics, and secure communications hardware. Their primary industry focus is Semiconductor Machinery Manufacturing (NAICS 333242), where they operate as a niche supplier of specialized capital equipment essential to front-end wafer fabrication. This positions them within the advanced electronics manufacturing ecosystem, serving defense, aerospace, and high-reliability commercial semiconductor producers who require precision, repeatability, and process control beyond standard industrial equipment. DISCO HI-TEC AMERICA, INC is structured as a 2L entity headquartered in San Jose, California, placing it at the heart of the global semiconductor innovation corridor. While no federal certifications are disclosed, their geographic location and contract history indicate a strategic alignment with U.S. government initiatives to strengthen domestic semiconductor production capacity. The company’s market positioning is that of a technical specialist providing mission-critical equipment to high-assurance manufacturing environments.

Key Performance Metrics

Awards Count

21

All time

Active

1

Currently performing

Completed

20

Past period of performance

Total Awards

All time

Contracts

Prime · all time

Subcontracts

Sub · all time

Grants

Prime · all time

Subgrants

Sub · all time

Award Analytics & Distribution

Awards by Agency
Awards by Agency Over Time
Awards by Place of Performance

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