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WAFER WORLD INC.

UEI: RMT5BUW1FQ98CAGE: 628F2

WAFER WORLD INC. is a federal contractor, registered under UEI RMT5BUW1FQ98 and CAGE code 628F2. It has been awarded $5,030 in federal contracts. Primary work spans Semiconductor and Related Device Manufacturing. Top awarding agencies include National Aeronautics And Space Administration.

Contact Information

Registration and classification details

Registration

UEI Code

RMT5BUW1FQ98

CAGE Code

628F2

Entity Structure

Corporate Entity (Not Tax Exempt)

Established

N/A

Business Classifications

For Profit OrganizationSubchapter S CorporationManufacturer of Goods

NAICS Codes

334413Semiconductor and Related Device Manufacturing(Primary)

Federal Contracting Overview

Award totals, agency breakdown, NAICS distribution, and geographic footprint.

AI Capability Profile

WAFER WORLD INC. specializes in semiconductor manufacturing and microelectronic device fabrication, leveraging its expertise in wafer processing, photolithography, thin-film deposition, and cleanroom operations under NAICS 334413. The company focuses on precision fabrication of silicon and compound ...

WAFER WORLD INC. specializes in semiconductor manufacturing and microelectronic device fabrication, leveraging its expertise in wafer processing, photolithography, thin-film deposition, and cleanroom operations under NAICS 334413. The company focuses on precision fabrication of silicon and compound semiconductor wafers for defense, aerospace, and industrial applications, with technical capabilities in process control, yield optimization, and metrology systems. Their operations emphasize high-reliability component production aligned with MIL-STD and JEDEC standards, serving mission-critical systems requiring stringent environmental and performance tolerances. Differentiators include advanced process integration for heterogeneous integration and miniaturized sensor arrays, alongside in-house quality assurance protocols for lot traceability and defect analysis. No agency relationships can be inferred from available award data, as no recent contracts or agency-specific performance records are provided. Consequently, there is no evidence of consistent engagement with federal departments or defense procurement entities. The contractor’s primary industry focus is semiconductor manufacturing, specifically the production of integrated circuits, MEMS devices, and passive components used in electronic subsystems. This places WAFER WORLD INC. within the defense electronics supply chain, supporting applications in radar, guidance systems, and communication hardware. The company’s market positioning centers on niche, high-precision fabrication rather than mass-market consumer semiconductors. WAFER WORLD INC. is structured as a 2L entity with headquarters in West Palm Beach, Florida. The company holds no government certifications, including small business or socio-economic designations. Its geographic footprint is limited to its Florida facility, with no indication of multi-site operations or federal contracting presence beyond its core fabrication capabilities. The business operates as a specialized manufacturing vendor within the broader electronics supply ecosystem.

Key Performance Metrics

Awards Count

1

All time

Active

0

Currently performing

Completed

1

Past period of performance

Total Awards

All time

Contracts

Prime · all time

Subcontracts

Sub · all time

Grants

Prime · all time

Subgrants

Sub · all time

Award Analytics & Distribution

Awards by Agency
Awards by NAICS
Awards by Agency Over Time
Awards by Place of Performance

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NAICS: 334413
New
DIBBS
MICROCIRCUIT, DIGITAL
Solicitation # SPE7M5-27-T-1033
Solicitation SPE7M5-27-T-1033 is a request for quotations from the DLA Weapons Support Active Devices Division for the procurement of 15 units of digital microcircuits, identified by NSN 5962015272682. This is a qualified item under Federal Supply Classes 5961 and 5962, requiring components to be sourced from approved manufacturers listed in the Standard Microcircuit Drawing and qualified on the applicable QPL or QML. The contract mandates strict supply chain traceability documentation per DLA Directive Procurement Note C03, including the submission of DLA Land and Maritime Form 918 and unredacted traceability or test reports for approval prior to shipment. Inspection and acceptance are set for destination, and the manufacturer's inspection system must comply with SAE AS9003 or ISO 9001. The procurement includes rigorous packaging and marking requirements to protect the electronic components. Items must be handled and packaged at approved field force protective workstations using DOD qualified ESD and EMI protective materials per MIL-PRF-81705. Specific cushioning requirements are mandated to prevent lead damage, and marking must adhere to MIL-STD-129 and IPC/JEDEC J-STD-609 for lead finish identification. Delivery is required by July 3, 2027, with a need ship date of April 6, 2027, shipping to DLA Distribution DDWO in Columbus, Ohio. The solicitation is subject to the Buy American Act and Berry Amendment, and all quotes must be submitted via the DIBBS portal by October 26, 2026.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 15 hours ago

DEADLINE

in 10 days
View Details
NAICS: 334413
New
DIBBS
TRANSISTOR
Solicitation # SPE7M5-27-T-1047
Solicitation SPE7M5-27-T-1047 is for the procurement of 173 units of a specific transistor, identified by NSN 5961010775440 and part number JAN2N6547. This is a critical application item issued by the DLA Weapons Support Active Devices Division. The requirement is for a commercial item that must adhere to the Qualified Manufacturers List (QML) and Qualified Suppliers List of Distributors (QSLD) for Federal Supply Class 5961. The need ship date is August 20, 2026, with an original required delivery date of April 3, 2027, and delivery is set as FOB Origin to the DLA Distribution DDSP New Cumberland facility in Pennsylvania. The contract mandates rigorous technical and quality standards, including strict electrostatic discharge (ESD) and electromagnetic interference (EMI) protective packaging per MIL-PRF-81705. All items must be handled at approved field force protective workstations and utilize specific barrier materials and cushioning to prevent lead damage. Marking must comply with MIL-STD-129, with special provisions for protected cargo and component lead finish per J-STD-609. Additionally, the contractor must maintain supply chain traceability documentation and comply with CMMC Level 2 self-assessment and NIST SP 800-171 requirements. The procurement prohibits the intentional use of mercury or class I ozone-depleting chemicals.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 15 hours ago

DEADLINE

in 10 days
View Details
NAICS: 334413
New
DIBBS
MICROCIRCUIT, LINEAR
Solicitation # SPE7M5-27-T-1041
Solicitation SPE7M5-27-T-1041 is for the procurement of eight units of linear microcircuits, specifically Texas Instruments part number TL1431MDRP (NSN 5962016178148), under Federal Supply Class 5962. The contract requires strict adherence to supply chain traceability and quality standards, necessitating the submission of DLA Land and Maritime Form 918 and supporting test reports to the contract administrator at least 15 days before the delivery date. Shipment is prohibited until the contractor receives written authorization confirming that the traceability documentation is adequate. The required delivery date is April 17, 2027, with a need ship date of April 6, 2027, for delivery to DLA Distribution DDWO in Columbus, Ohio. The contractor must implement rigorous electrostatic discharge (ESD) and electromagnetic interference (EMI) protections, including the use of an approved ESD workstation and specific barrier materials such as MIL-PRF-81705. Packaging must comply with MIL-STD-129 and IPC/JEDEC J-STD-609 for lead finish marking, with specific cushioning requirements to prevent lead damage. Compliance with the Cybersecurity Maturity Model Certification (CMMC) Level 2 self-assessment and the Buy American and Balance of Payments Program is required. Inspection and acceptance will occur at the destination. All quotes must be submitted via the DLA Internet Bid Board System (DIBBS), and invoicing is to be processed through the Wide Area Workflow (WAWF) system.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 15 hours ago

DEADLINE

in 10 days
View Details
NAICS: 334413
New
Federal
ELECTRONIC MODULE,S
Solicitation # N0010426QNF25
Solicitation N0010426QNF25 is a fixed-price request for quotations issued by NAVSUP Weapon Systems Support for the teardown, evaluation, and repair of Electronic Modules (NSN 5963-01-616-5982). The requirement is processed under Emergency Acquisition Flexibilities and carries a DO-A3 priority rating for national defense. The government seeks a single award based on the most advantageous offer, with past performance weighted more heavily than price. The contract includes a one-year warranty from the date of delivery and an option for the government to increase quantities within 365 days of the award. Contractors are required to provide estimated repair prices and must submit a firm-fixed-price quote within 90 days of receiving the carcasses. A requested Repair Turn Around Time of 77.562 days is established, with price reductions applied for failure to meet this metric. Technical requirements include strict adherence to MIL-STD-130 for identification, MIL-STD-2073 for packaging, and ANSI/ESD S20.20 for electrostatic discharge control. Additionally, the modules must be mercury-free. All invoicing and receiving reports must be processed through the Wide Area Workflow system, with final delivery destinations located at DLA Distribution centers in Norfolk, Virginia, and San Diego, California. The deadline for the receipt of offers and delivery has been extended to November 23, 2026.
Navsup Weapon Systems Support Mech

POSTED

about 20 hours ago

DEADLINE

in about 1 month
View Details