This Pre-Solicitation opportunity from Department Of Defense was posted on June 29, 2011. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
59 -- Electronics Assembly / Packaging of Micro-Electro-Mechanical Systems (MEMS) Devices
Contract Overview
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The Space and Naval Warfare Systems Center, Pacific is seeking contractual support for the Advanced Integrated Circuit and Sensors Branch to handle the complete assembly and packaging of Micro-Electro-Mechanical Systems devices. The scope of work involves the precise alignment and mounting of components including MEMS dies, light sources, monitor photodiodes, resistive heating elements, and spacer materials into ceramic or plastic packages. The process requires wire bonding for electrical connections followed by hermetic sealing in a vacuum or inert atmosphere. This procurement is issued as a Firm-Fixed-Price purchase order and is designated as a Total Small Business Set Aside under NAICS code 334413. The solicitation, identified as RFQ N66001-11-Q-0073, is available exclusively in electronic format via the SPAWAR E-Commerce website. Interested firms must adhere to the specified response deadline, with the solicitation anticipated for release around July 11, 2011.
General Info
Contract Value
$55,821.34Place of Performance
CA, USASet-Aside
Awardee
NXGEN ELECTRONICS, INC.Award Issued Date
Documents
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Timeline
Submission Closed
Organization & Contact Information
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