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59--OSIRIS REX OVIRS FLIGHT SENSOR CHIP ASSEMBLY

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NNG12434218RFederal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

NASA’s Goddard Space Flight Center (GSFC) is seeking to procure a flight sensor chip assembly (SCA) for the OVIRS instrument, with the purchase intended from Teledyne Imaging Sensors (TIS). This sensor chip assembly is specially designed to detect visible and infrared radiation across wavelengths from 0.4 to 4.3 microns and will interface with a SIDECAR ASIC to manage clocks, biases, and analog data output for digitization and further processing. TIS will be responsible for designing the SCA by customizing the HgCdTe detector materials to meet the specific spectral detection requirements, as well as fabricating, thermally cycling, and conducting functional and performance tests to ensure compliance with flight standards. The assembly incorporates the Teledyne-developed H1RG Readout Integrated Circuit (ROIC), which is compatible with the SIDECAR ASIC baselined for OVIRS, leveraging TIS’s extensive flight experience with this technology. The procurement process is not intended as a commercial item acquisition under FAR Part 12, and NASA invites interested organizations to submit their capabilities and qualifications by May 14, 2012, to determine if the procurement will proceed competitively. Responses are to be submitted in writing, with no oral communications accepted. The evaluation of these submissions will decide whether a full and open competition will be conducted, a determination solely at the government’s discretion. All responsible sources may submit offers for consideration. Additionally, NASA clause 1852.215-84 regarding the Ombudsman applies to this acquisition, providing a point of contact to address concerns related to the procurement process.

General Info

NASA seeks Teledyne to supply infrared sensor chip assembly for OVIRS, evaluating proposals by May 14, 2012.

Agency

N/A

NAICS

541330 - Engineering Services

Place of Performance

Not specified

Set-Aside

NONE

Documents

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Timeline

PhasePresolicitation

PostedApr 27

Presolicitation

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Organization & Contact Information

AgencyN/A

ContactsNo contacts available

OfficeN/A

Organization / Agency

N/A

Office AddressN/A

ContactsNo contact information available

Full Description

NASA/GSFC has a requirement for a flight sensor chip assembly for the OVIRSinstrument.NASA/GSFC intends to purchase the items from Teledyne Imaging Sensors (TIS), Camarillo,CA. The sensor chip assembly will also provide the follwing functions: detect visibleand infrared radiation between the 0.4 to 4.3 micron wavelengths; interface with aSIDECAR ASIC to receive clocks and biases; read out analog data tothe SIDECAR for datadigitization and further processing. TIS will design the sensor chip assembly (SCA) bytailoring the HgCdTe proportions for selective detection of visible and infraredradiation between 0.4 to 4.3 microns. Fabricate, thermally cycle and functional &performance test the SCAs to meet flight requirements. TIS is one of the feworganizations with extensive flight experience interfacing to the SIDECAR ASIC, which isbeing utilized on OVIRS. The subjecct of this procurement, a visible and infrared sensorchip assembly, uses the Teledyne developed H1RG Readout Integrated Circuit (ROIC). ThisROIC is pin for pin compatible with the SIDECAR ASIC that is baselined for IVIRS. The Government does not intend to acquire a commercial item using FAR Part 12. Interested organizations may submit their capabilities and qualifications to perform theeffort in writing to the identified point of contact not later than 4:30 p.m. local timeon 5/14/12. Such capabilities/qualifications will be evaluated solely for the purpose ofdetermining whether or not to conduct this procurement on a competitive basis. Adetermination by the Government not to compete this proposed effort on a full and opencompetition basis, based upon responses to this notice, is solely within the discretionof the government.Oral communications [are not] acceptable in response to this notice.All responsible sources may submit an offer which shall be considered by the agency.[OMBUDSMAN STATEMENT IS REQUIRED] NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for thisacquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html .

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