99 -- Free-Forming Objects with Low-Binder Slurry

Free-Forming Objects with Low-Binder SlurryUS Patent 6,027,326 Technology Transfer Opportunity Sandia National Laboratories (Albuquerque, New Mexico) has developed a patented process for fabricating products from fine powders. The process can be used to rapidly produce prototypes or manufacture parts in large quantities. A slurry of the material containing between 0.5 and 10 percent binder is deposited on a substrate to fabricate parts directly from fine particle powders without the use of molds. The solid freeform fabrication technique for fine particles uses computer controlled layer-wise extrusion of colloidal slurries. Particle sizes are typically 0.5 to 5 - m, and the slurry solids content ranges between 50 and 60 volume percent solids, depending on the particle size distribution and morphology. The liquid carrier is usually water. The rheology of the slurry mixture is modified with minor additions of dispersants and organic binders to form pastes with a plastic consistency suitable for extrusion. Orifice sizes range between 200 and 2000 - m, and parts may be built at rates on the order of 1 cm3 per minute. Materials demonstrated include Al2O3, ZrO2, Si3N4, lead zirconate titanate (PZT), W, and Ag. Since the process is essentially binderless (less than 1% organics) parts can be dried, and completely sintered into dense, strong parts in less than 24 hours. Sandia is making this technology available to companies interested in partnering with Sandia to develop near term and/or future applications via licensing, including up to exclusive field of use licenses, or cooperative development agreements. For further information, please respond by email or fax to Colleen Kearney within 15 days of this announcement at: Sandia National Laboratories, MS 0114, P. O. Box 5800, Albuquerque, New Mexico 87185-0114. contact@example.gov or Fax: +1 (555) 000-0000. Please indicate the date, number and title of this FBO notice and the specific interest your company has developing and commercializing this technology. End date for all inquiries is April 15, 2005