This Solicitation opportunity from Florida was posted on August 6, 2025. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Advanced Oxide Etch Tool

Closed

ITB-13542State & Local

Submission Closed08/28/2025, 12:00:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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DEADLINE

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AI Contract Overview

The University of Central Florida is seeking bids for an advanced oxide etch tool designed for inductively coupled plasma etching of fused silica wafers, specifically to transfer etch profiles from analog photoresist into fused silica substrates without causing damage. The equipment must meet detailed specifications outlined on pages 13-14 of the bid sheet. The solicitation, identified as ITB 2025-02OC, was posted on August 6, 2025, with a response deadline set for August 28, 2025, at 2:00 PM EST. Interested vendors are invited to participate in the bid opening via a Zoom meeting scheduled for the same day and time. The contract value is estimated to range between $500,000 and $1,500,000, with the project located in Florida. The primary contact for inquiries is Brandon Orofino, reachable by email at [email hidden] or by phone at [phone hidden]. Additional details and the bid submission portal can be accessed through the Florida Marketplace link provided.

General Info

Agency

University of Central Florida

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

FL, USA

Set-Aside

NONE

Documents

ITB 2025-02OC: Advanced Oxide Etch Tool

itb

High

AI Contract Breakdown

Uniform Contract Format

Contract not broken down yet

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Timeline

PhaseClosed

PostedAug 6

Solicitation

Response DeadlineAug 28

Deadline has passed

Submission Closed

08/28/2025, 12:00:00 AM UTC

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Organization & Contact Information

AgencyUniversity of Central Florida

Contacts1 person available

OfficeN/A

Organization / AgencyUniversity of Central Florida

Office AddressN/A

Contacts

Brandon Orofino

contact@example.gov

+1 (555) 000-0000

Full Description

The University of Central Florida is soliciting bids for an advanced oxide etch tool for Inductively Coupled Plasma etching of fused silica wafers. Specifically, for the transfer etching of analog photoresist profiles into fused silica substrates without damage for high optical quality elements at the wafer scale. The required specifications are located on the Bid Sheet (pages 13-14). Questions are due August 14, 2025 at 5:00 PM ESTDue Date is August 28, 2025 at 2:00 PM EST Topic: ITB 2025-02OC Opening on 8/28/2025 at 2:00 PM EST Join Zoom Meeting https://ucf.zoom.us/j/92945981510?pwd=ciGX2eR6IsKUefKn2UBXE4dzdac0ai.1Meeting ID: 929 4598 1510 Passcode: 250910