This Government Contract opportunity from Department Of Defense was posted on April 2, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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ASIC-Based Sensor Manufacturing & Integration

Closed

Federal

Submission Closed06/17/2026, 04:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

The contract focuses on the scalable manufacturing and integration of Application-Specific Integrated Circuits (ASICs) designed for use in compact, low-power, and rugged sensor systems. These ASICs are intended to enhance sensor performance by providing custom solutions tailored to specialized applications, particularly those requiring durability and energy efficiency. The project is aimed at meeting the technical and operational demands of advanced sensor technologies within defense settings. Issued by the Department of Defense and associated with the Aberdeen Proving Ground as the place of performance, this subcontract falls under NAICS code 334418, which pertains to semiconductor manufacturing. The solicitation was posted on April 2, 2026, with a response deadline set for June 17, 2026. Although specific details about set-aside types and organization eligibility are not provided, the contract emphasizes the importance of collaboration with experienced manufacturers capable of delivering high-quality ASIC components to support ruggedized sensor systems in defense applications.