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Back-Illuminated CMOS Image Sensor Fabrication

Active

Federal

Response Deadline08/19/2026, 08:30:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The National Aeronautics And Space Administration, through the NASA Shared Services Center, is seeking a subcontract for the full fabrication of six science-grade back-illuminated CMOS image sensors, specifically the CIS115 model. The scope of work encompasses comprehensive wafer processing, thinning, and the optimization of backside illumination, as well as the application of an anti-reflection coating to ensure high-performance imaging capabilities. This procurement falls under NAICS code 334418 and was posted on August 14, 2026. Interested parties must submit their responses by the deadline of August 19, 2026.

General Info

NASA seeks a subcontract for fabricating six science-grade CIS115 CMOS image sensors.

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

MS

Set-Aside

NONE

Documents

This scope was carved out of 80NSSC26939941Q.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

ETU AND FLT CIS115 DETECTORS FOR THE DAVINCI/CUVIS INSTRUMENT

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Timeline

PostedAug 14

subcontract

Response DeadlineAug 19

Submission deadline

Response Deadline

08/19/2026, 08:30:00 PM UTCin 4 days

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Full fabrication of six science-grade back-illuminated CMOS image sensors (CIS115) with anti-reflection coating, including wafer processing, thinning, and backside illumination optimization.

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