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Bare PCB Fabrication (Base Board)

Open
Federal

Contract Overview

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This subcontract involves the fabrication of a single unpopulated bare printed circuit board for prime contractors supporting the DLA Weapons Support Active Devices Division. The manufacturer is responsible for producing the board substrate and circuitry in strict accordance with reference drawings 81755 654P5333 Rev E, 81755 654P5330 Rev HK, and TDP Rev A Gen 10 specifications to ensure all dimensional and electrical requirements are met. The project falls under NAICS code 334413 and requires the contractor to have the necessary capabilities to handle ITAR and EAR controlled technical data. Performance will take place in New Cumberland, Pennsylvania, with a response deadline set for November 26, 2026.

General Info

Fabrication of one unpopulated bare PCB per specifications for DLA Weapons Support.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-Q-0175.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMBLY

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Timeline

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Response Deadline

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Response Deadline

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabricates the unpopulated bare printed circuit board for prime contractors on DLA Weapons Support Active Devices Division projects. Manufactures the board substrate and circuitry per reference drawings 81755 654P5333 Rev E and 81755 654P5330 Rev HK and TDP Rev A Gen 10 specifications. Requires capability to handle ITAR/EAR controlled technical data. Delivers one bare printed circuit board meeting all dimensional and electrical specifications.

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