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This Government Contract opportunity from Department Of Defense was posted on September 4, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Bare PCB Fabrication

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413
New
DIBBS
SEMICONDUCTOR DEVICE, T
Solicitation # SPE7M5-27-T-1597
Solicitation SPE7M5-27-T-1597 is a request for quotations issued by the DLA Weapons Support Active Devices Division for the procurement of three semiconductor device thyristors, identified by NSN 5961-01-115-2436. This is a Foreign Military Sales requirement for Taiwan, with delivery terms set as FOB Origin and a required delivery date of September 2, 2026. The items must adhere to specific technical data, including Teledyne Drawing 6A2027 and MIL-STD-280A for interchangeability, and must undergo gross leak testing per MIL-STD 750. The contract requires strict adherence to supply chain traceability documentation per DLA Directive Procurement Note C03 and mandates that suppliers be listed on the Qualified Suppliers List of Distributors or Qualified Testing Suppliers List for FSC 5961 and 5962. Packaging and marking must comply with MIL-DTL-19491, MIL-STD-129, and IPC/JEDEC J-STD-609 for lead finish identification. Inspection and acceptance will occur at the point of origin. The procurement is subject to various federal regulations, including the Buy American Act, DFARS prohibitions on certain telecommunications equipment, and NIST SP 800-171 cybersecurity standards. Payment and receiving reports must be processed electronically through the Wide Area WorkFlow system. Offers involving additive manufacturing are ineligible for award unless specifically authorized, and the government may apply a price evaluation preference for HUBZone concerns. Quotations are due by November 9, 2026.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 18 hours ago

DEADLINE

in 12 days

AI Contract Overview

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This subcontract involves the fabrication of raw, unpopulated printed circuit boards for prime contractors supporting Department of Defense electronic component projects. The scope of work includes chemical etching, drilling, plating, and solder mask application using high-reliability substrates such as polyimide or FR-4. All delivered bare boards must strictly conform to the design specifications associated with Cage Code 03538. The opportunity is managed by the Navsup Weapon Systems Support Mech under NAICS code 334413. The solicitation was posted on September 4, 2026, with a response deadline of October 5, 2026.

General Info

Fabrication of unpopulated PCBs for DoD projects under Cage Code 03538.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0010426QYAF9.

The full solicitation package (4 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

59--CIRCUIT CARD ASSEMB

AI Contract Breakdown

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabricates raw, unpopulated printed circuit boards for prime contractors on Department of Defense electronic component projects. Performs chemical etching, drilling, plating, and solder mask application using high-reliability substrates such as FR-4 or polyimide. Boards must conform to the design represented by Cage Code 03538. Delivers bare printed circuit boards.

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