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--BGA Mounting for Test Device

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W9124Q-08-P-BGAMOUNTFederal

Contract Overview

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The Mission and Installation Contracting Command at White Sands Missile Range, New Mexico, plans to award a contract under FAR 6.302-1 to TEAM Technologies, Inc., based in Albuquerque, NM. The contract requires the production of 36 extremely small four-pin Ball Grid Array (BGA) circuit boards designed to test a USB protection device for the M1 Abrams tank. TEAM Technologies is capable of fabricating the required printed circuit boards, placing components, performing x-ray inspections, and reflowing components as needed to meet quality standards. This solicitation, identified as W9124Q-08-P-BGAMOUNT, was posted on September 15, 2008, by the Department of Defense office at White Sands Missile Range. The procurement falls under NAICS code 334418, relating to electronic component manufacturing. Interested parties were instructed to respond to the designated email contact by 10:00 a.m. Mountain Daylight Time on September 16, 2008. The contract emphasizes the importance of quality assurance and precision in manufacturing to meet the specific testing needs for the military application.

General Info

Contract awarded to TEAM Technologies for 36 small BGA circuit boards testing USB protection for M1 Abrams.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

NM

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NONE

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Organization & Contact Information

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AgencyDepartment Of Defense → W6QM Micc-White Sands
ContactsNo contacts available
OfficeWHITE SANDS MISSILE R, NM, 88002-5201, USA
Office AddressWHITE SANDS MISSILE R, NM, 88002-5201, USA
ContactsNo contact information available

Full Description

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The Mission and Installation Contracting Command at White Sands Missile Range, NM intends to award a contract pursuant to FAR 6.302-1 to TEAM Technologies, Inc., 1400 Eubank SE, Albuquerque, NM 87123. We have a requirement for an extremely small four pin Ball Grid Array (BGA) to test a USB protection device for the M1 Abrams. Team Technologies has the capability to build a PC board of the required size, place the components, x-ray test inspect the components, and reflow those not meeting quality to insure the product is acceptable. Quantity required is 36 BGA circuit boards. Respond to contact@example.gov by 16 Sep 08 at 10:00 a.m. M.D.T.

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