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This Subcontract opportunity from Department Of Defense was posted on October 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Circuit Card Assembly and Population

Closed
Federal

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This subcontract for Circuit Card Assembly and Population supports the DLA Weapons Support Maritime Supply Chain under the Department of Defense. The project involves the assembly of electronic components onto bare PCBs, utilizing a comprehensive technical process that includes solder paste application, component placement, reflow soldering, wave soldering, and manual soldering. To ensure precision and quality, the contractor will employ SMT pick-and-place machines, reflow ovens, and X-ray inspection, with all work adhering to IPC-A-610 and DLA RA001 quality standards. The primary deliverable for this contract is 2,000 populated and soldered circuit card assemblies. Performance will take place in New Cumberland, Pennsylvania. Interested parties should note the response deadline of October 23, 2026, for this effort categorized under NAICS code 334412.

General Info

Subcontract for 2,000 circuit card assemblies for DoD, due October 23, 2026.

NAICS

334412 - Bare Printed Circuit Board Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M1-27-T-0879.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMBLY

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs assembly of electronic components onto bare PCBs for prime contractors on DLA Weapons Support Maritime Supply Chain projects. Executes solder paste application, component placement, reflow soldering, wave soldering, and manual soldering. Utilizes SMT pick-and-place machines, reflow ovens, and X-ray inspection. Adheres to IPC-A-610 and DLA RA001 quality requirements. Delivers 2,000 populated and soldered circuit card assemblies.

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Miguel
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Keith Deutsch
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