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Circuit Card Assembly and Soldering

Active

Federal

Response Deadline11/06/2026, 08:30:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract for Circuit Card Assembly and Soldering supports prime contractors on projects for the Department of Defense agency Navsup Weapon Systems Support. The scope of work involves populating bare PCBs with components utilizing SMT pick-and-place machines, reflow ovens, and wave soldering equipment. All production must adhere to Cage Code 53711 and TDP Version No. 002, with a strict requirement that no mercury-containing solder or flux is used in the process. The contractor is responsible for the delivery of completed and tested Circuit Card Assemblies under NAICS code 334412. The opportunity was posted on October 7, 2026, with a response deadline of November 6, 2026.

General Info

Agency

Department Of Defense → Navsup Weapon Systems Support Mech

NAICS

334412 - Bare Printed Circuit Board Manufacturing

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0010426QNF36.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

AI Contract Breakdown

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Timeline

PostedOct 7

subcontract

Response DeadlineNov 6

Submission deadline

Response Deadline

11/06/2026, 08:30:00 PM UTCin 30 days

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech

Office AddressN/A

ContactsNo contact information available

Full Description

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Performs circuit card assembly for prime contractors on Navsup Weapon Systems Support projects. Populates bare PCBs with components using SMT pick-and-place machines, reflow ovens, and wave soldering equipment per Cage Code 53711 and TDP Version No. 002. Ensures no mercury-containing solder or flux is utilized. Delivers completed and tested Circuit Card Assemblies.

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