Circuit Card Assembly (CCA) Manufacturing
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The contract requires the manufacture of a circuit card assembly identified by NSN 5998-01-436-5290 in full compliance with military specifications, encompassing all stages from component sourcing and printed circuit board fabrication to assembly, soldering, and final inspection. Every step must adhere to stringent defense standards to ensure reliability, durability, and performance under demanding operational conditions. The work is being procured as a subcontract under the Department of Defense, with the Defense Logistics Agency serving as the overseeing organization, and the NAICS code 334418 confirms the focus on electronic component manufacturing. The project is scheduled with a posted date of July 21, 2026, indicating it is a future opportunity with anticipated award timing aligning with military procurement cycles. All manufacturing activities are expected to occur at locations designated by the contractor, though specific performance locations are not detailed. The contract does not specify a set-aside classification, meaning it is open to any qualified subcontractor without preference for small businesses or other categories. The award will be managed under contract number SPE4A623PYR28 through the DIBBS system, and compliance with all technical, quality, and delivery requirements will be mandatory for successful performance.
General Info
Agency
NAICS
Place of Performance
Not specifiedSet-Aside
Documents
This scope was carved out of SPE4A623PYR28.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
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