Circuit Card Assembly (CCA) Manufacturing and Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The contract entails the full lifecycle manufacturing of a military-grade Circuit Card Assembly identified by NSN 5998014335251, encompassing all stages from component procurement and printed circuit board fabrication to surface mount and through-hole assembly, precision soldering, and final integration. All work must adhere to strict military specifications to ensure reliability, durability, and performance under extreme operational conditions. The manufacturing process requires certified sourcing of components, compliance with defense-grade quality standards, and rigorous testing protocols to meet the stringent requirements of the Department of Defense. This is a subcontract issued under the Defense Logistics Agency, with the NAICS code 334418 indicating it falls within the category of other electronic component manufacturing. The solicitation was posted on July 14, 2026, and the place of performance is not specified, implying flexibility in facility location provided all contractual and security requirements are met. The contract is part of the broader defense supply chain managed through the DIBBS platform with the award reference SPE7M126P3294, and the awardee is expected to support mission-critical military systems with zero tolerance for defects or delays.
General Info
Agency
NAICS
Place of Performance
Not specifiedSet-Aside
Documents
This scope was carved out of SPE7M1-26-T-3208.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
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