This Government Contract opportunity from Department Of Defense was posted on May 6, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly (CCA) Manufacturing and Integration
Contract Overview
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The contract entails the full manufacturing, component integration, and assembly of ten Circuit Card Assemblies under CLIN 0001AB, encompassing all phases from PCB fabrication through surface mount technology assembly to final integration. The work requires precise execution of electronic component placement, soldering, testing, and system-level integration to meet rigorous defense standards. The solicitation is issued as a subcontract under the NAICS code 334412, indicating classification within electronic component and board manufacturing, and is managed by the Department of Defense through the Pa DLA Aviation office in Philadelphia. Although specific performance location and point of contact details are not provided, the response deadline is set for April 21, 2026, at 8:30 PM, and the opportunity was posted on May 6, 2026, leaving a narrow window for qualified vendors to submit proposals.
General Info
Agency
NAICS
Place of Performance
PASet-Aside
Documents
This scope was carved out of SPRPA126QXA41.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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