This Government Contract opportunity from Department Of Defense was posted on August 7, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Circuit Card Assembly (CCA) Manufacturing and Qualification

Closed

Federal

Submission Closed08/15/2026, 04:59:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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about 21 hours ago

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in 7 days

AI Contract Overview

The contract requires the manufacture of four B-2 Circuit Card Assemblies, encompassing full-scale production activities from component procurement and printed circuit board fabrication to final assembly, testing, and qualification. The vendor is responsible for ensuring all components and processes meet stringent technical and quality standards, with a mandatory requirement to submit a Source Approval Request package for government review and approval prior to proceeding with production. This ensures compliance with defense-specific sourcing and reliability requirements. The solicitation is classified as a subcontract under NAICS code 334418 and is managed by the Department of Defense through the Ok DLA Aviation office in Oklahoma City. Responses must be submitted by August 15, 2026, at 4:59 AM, with the opportunity posted on August 7, 2026. While specific performance location and point of contact details are not provided, the work is expected to adhere to federal defense contracting standards, with deliverables subject to rigorous qualification and acceptance testing before contract completion.

General Info

Manufacture four B-2 Circuit Card Assemblies per defense standards, with Source Approval Request required before production.

Agency

Department Of Defense → Ok DLA Aviation At Oklahoma City

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

OK, USA

Set-Aside

NONE

Documents

This scope was carved out of FD20302700176.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB_End_Item_B-2_NSN_5998014281837FW_PN_795306-10

AI Contract Breakdown

Uniform Contract Format

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The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed

PostedAug 7

subcontract

Response DeadlineAug 15

Deadline has passed

Submission Closed

08/15/2026, 04:59:00 AM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Ok DLA Aviation At Oklahoma City

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Ok DLA Aviation At Oklahoma City

Office AddressN/A

ContactsNo contact information available

Full Description

Manufacture of 4 B-2 Circuit Card Assemblies including component procurement, PCB fabrication, assembly, testing, and qualification. Vendor must submit a Source Approval Request (SAR) package for government approval.