Circuit Card Assembly (CCA) Manufacturing

The contract entails full build-to-print manufacturing of a circuit card assembly for the Defense Logistics Agency under the Department of Defense, covering all aspects from component sourcing and PCB fabrication—should the board not be provided—to surface mount and through-hole assembly, soldering, and final integration, ensuring delivery to DLA specifications. All manufacturing processes must adhere strictly to the provided technical prints and quality standards, with no deviation permitted without formal approval, and the work is expected to meet military-grade reliability and performance benchmarks. The solicitation falls under NAICS code 334418 for Electronic Component and Product Manufacturing, and while the specific location of performance is not defined, the final delivery point is governed by DLA requirements. This is structured as a subcontract and does not specify a set-aside classification, meaning it is open to general competition without preference for small, disadvantaged, or veteran-owned businesses. The contract was posted on July 13, 2026, and the award details can be referenced via the provided DIBBS link, with compliance to federal defense procurement regulations and supply chain security protocols being critical to execution.