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Electronic Module Manufacturing and Assembly

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract entails the full lifecycle production of a military-grade electronic module, encompassing printed circuit board assembly, rigorous testing, and secure packaging adhering to all applicable military standards. This subcontract supports the Defense Logistics Agency under the Department of Defense and is classified under NAICS code 334418, indicating specialized electronic component manufacturing. The work must meet stringent defense requirements for reliability, durability, and performance under extreme conditions, with all phases executed to ensure compliance with federal and military specifications. The place of performance and specific location details are not provided, but the contract is active and accessible through the DIBBS system under award number SPE7M526P1709, posted on July 13, 2026, for potential subcontractors to bid and execute under the broader defense supply chain.

General Info

Military-grade electronic module production under Defense Logistics Agency, compliant with strict military standards.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-4707.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

59--ELECTRONIC MODULE,S

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Timeline

Posted

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Full lifecycle production of a military-grade electronic module including PCB assembly, testing, and packaging per military standards.

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Naval Air Warfare Center

POSTED

about 19 hours ago

DEADLINE

in 8 days
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