This Government Contract opportunity from Department Of Defense was posted on May 4, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly (CCA) Manufacturing
Contract Overview
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AI Contract Overview
The contract solicits full manufacturing services for a printed circuit card assembly, encompassing all stages from component sourcing and printed circuit board fabrication to surface mount technology and through-hole assembly, soldering, and final inspection. The work must strictly adhere to military standards and hazardous materials regulations, ensuring compliance with rigorous defense sector requirements for quality, safety, and environmental control. All processes must be executed to support mission-critical applications within the Department of Defense supply chain. The contract is classified as a subcontract under NAICS code 334418, issued by the Department of Defense through SPRMM1 DLA Mechanicsburg, with performance required to take place in Mechanicsburg. The solicitation was posted on May 4, 2026, and responses are due by June 1, 2026, at 8:30 PM Eastern Time. While no set-aside type is specified, the procurement underscores the need for qualified manufacturers capable of delivering high-reliability electronic assemblies under stringent defense specifications.
General Info
Agency
NAICS
Place of Performance
Mechanicsburg, PA, USASet-Aside
Documents
This scope was carved out of SPRMM1-26-Q-KE52.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
SPRMM1-26-Q-KE52
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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