Circuit Card Assembly (CCA) Manufacturing
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The contract involves the manufacture of printed circuit card assemblies specifically for defense applications, requiring full compliance with military standards throughout all production phases. This includes the sourcing of components, fabrication of printed circuit boards, surface mount technology assembly, and through-hole assembly, ensuring the final products meet rigorous performance and reliability criteria essential for military systems. The work is to be conducted under a subcontract arrangement, with the North American Industry Classification System code 334412 indicating the scope falls under semiconductor and other electronic component manufacturing. The solicitation was posted on August 3, 2026, with a strict deadline for responses on October 30, 2026, at 9:00 PM. The contracting activity is managed by the Department of Defense through the Defense Logistics Agency Aviation office located in Huntsville, though specific performance location details are not provided. All work must adhere to applicable defense regulations and quality controls without exception.
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