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Circuit Card Assembly (CCA) Manufacturing

Active

Federal

Response Deadline09/15/2026, 04:59:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract opportunity with the Department of Defense, specifically the DLA Aviation office in Oklahoma City, involves the full turnkey manufacturing of circuit card assemblies. The scope of work encompasses the entire production lifecycle, including component sourcing, PCB fabrication, SMT or through-hole assembly, soldering, and final testing. The project is categorized under NAICS code 334418. Interested parties must submit their responses by the deadline of September 15, 2026, following the posting date of August 14, 2026.

General Info

DOD DLA Aviation subcontract for turnkey circuit card assembly manufacturing by September 15, 2026.

Agency

Department Of Defense → Ok DLA Aviation At Oklahoma CityView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

OK, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRTA126Q2063.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMBLY

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Timeline

PostedAug 14

subcontract

Response DeadlineSep 15

Submission deadline

Response Deadline

09/15/2026, 04:59:00 AM UTCin about 1 month

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Organization & Contact Information

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AgencyDepartment Of Defense → Ok DLA Aviation At Oklahoma City

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Ok DLA Aviation At Oklahoma City

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Office AddressN/A

ContactsNo contact information available

Full Description

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Full turnkey manufacturing of a circuit card assembly including component sourcing, PCB fabrication, SMT or through-hole assembly, soldering, and final testing.

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