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Electronics & Semiconductor Packaging Integration

Active

Federal

Response Deadline11/15/2026, 12:00:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract, managed by the Department of Energy through Triad, focuses on the integration of hydrogen getter materials into semiconductor and sensor packaging. The primary objective is to protect these components from hydrogen exposure, which can lead to signal degradation, embrittlement, and overall device failure. The project is based in Los Alamos, New Mexico, and falls under NAICS code 334418. Interested parties must submit their responses by November 15, 2026, following the posting date of August 14, 2026.

General Info

DOE subcontract for hydrogen getter materials in semiconductor packaging, due November 15, 2026.

Agency

Department Of Energy → Triad - DOE ContractorView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Los Alamos, NM, 87545, USA

Set-Aside

NONE

Documents

This scope was carved out of S-193538.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

High-Capacity Hydrogen and Hydrogen Isotope Getters

AI Contract Breakdown

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Timeline

PostedAug 14

subcontract

Response DeadlineNov 15

Submission deadline

Response Deadline

11/15/2026, 12:00:00 AM UTCin 3 months

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Organization & Contact Information

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AgencyDepartment Of Energy → Triad - DOE Contractor

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Energy → Triad - DOE Contractor

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Integrate hydrogen getter materials into semiconductor and sensor packages to prevent embrittlement, signal degradation, and failure due to hydrogen exposure.

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