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Circuit Card Assembly Fabrication and Assembly

Active

Response Deadline12/03/2026, 09:30:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract, issued by the Department of the Navy via DLA Mechanicsburg, requires the manufacture and assembly of two Circuit Card Assemblies under NIIN 015251133. The scope of work includes the fabrication of PCBs, component sourcing, and population using either SMT or through-hole assembly methods. All work must adhere to Higher Level Inspection standards as specified in TDP Version 004. The project is categorized under NAICS code 334418 and will be performed in Mechanicsburg. A critical requirement for the contractor is maintaining CMMC cybersecurity compliance in accordance with DFARS 252.204-7025. The solicitation was posted on November 3, 2026, with a response deadline of December 3, 2026.

General Info

Agency

Department Of The Navy → SPRMM1 DLA Mechanicsburg

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

MECHANICSBURG, PA, 17055-0788, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM127QKA55.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB — 5998015251133 — SPRMM127QKA55

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Timeline

PostedNov 3

subcontract

Response DeadlineDec 3

Submission deadline

Response Deadline

12/03/2026, 09:30:00 PM UTCin about 1 month

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Organization & Contact Information

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AgencyDepartment Of The Navy → SPRMM1 DLA Mechanicsburg

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of The Navy → SPRMM1 DLA Mechanicsburg

Office AddressN/A

ContactsNo contact information available

Full Description

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Manufactures and assembles Circuit Card Assemblies (NIIN: 015251133) for prime contractors on Department of Defense projects. Fabricates PCBs, sources and populates components via SMT or through-hole assembly, and performs Higher Level Inspection per TDP Version 004. Requires CMMC cybersecurity compliance per DFARS 252.204-7025. Delivers two completed Circuit Card Assemblies.

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