Sensor Control Electronics & PCB Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract, titled Sensor Control Electronics and PCB Assembly, involves the design and fabrication of printed circuit boards and electronic control units for the GS207 sensor system under DLA Weapons Support projects. The scope of work focuses on producing signal processing boards for gimbal stabilization, utilizing clean-room assembly and surface mount technology to deliver fully tested electronic control boards and wiring harnesses. Managed by DLA Land Warren for the Department of Defense under NAICS code 334418, the contract mandates strict adherence to IPC-A-610 and MIL-STD-810 compliance standards. The opportunity was posted on November 3, 2026, with a response deadline set for November 18, 2026.
General Info
Place of Performance
MI, USASet-Aside
Documents
This scope was carved out of SPRDL1-27-R-A006.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
Sensor Gimbal GS207
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Timeline
Response Deadline
Organization & Contact Information
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