This Government Contract opportunity from Department Of Defense was posted on May 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly Manufacturing and Testing
Contract Overview
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AI Contract Overview
The contract entails the full manufacturing, assembly, and functional testing of a circuit card assembly identified by NSN 7HH 5998-01-619-7583, with all work required to meet strict military standards for performance, packaging, and traceability. The scope demands end-to-end production capability including component integration, assembly processes, and rigorous functional verification to ensure compliance with defense specifications. All materials, processes, and documentation must support full supply chain transparency and accountability consistent with Department of Defense requirements. This is a subcontract opportunity posted on May 5, 2026, with a response deadline of June 4, 2026, at 8:30 PM. It falls under NAICS code 334418 for Other Electronic Component Manufacturing and is issued by the Department of Defense through SPRMM1 DLA Mechanicsburg. The place of performance and point of contact details are not specified, but the work must be executed in accordance with federal defense contracting protocols. The full solicitation can be accessed via the provided SAM.gov link for additional technical or administrative requirements.
General Info
Agency
NAICS
Place of Performance
PA, USASet-Aside
Documents
This scope was carved out of SPRMM1-26-Q-GD57.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
SPRMM1-26-Q-GD57-CIRCUIT CARD ASSEMB
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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