This Government Contract opportunity from Department Of Defense was posted on May 13, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly Manufacturing
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract entails the full manufacturing of a circuit card assembly, covering all stages from component sourcing and printed circuit board fabrication to surface-mount assembly, soldering, and initial functional verification. The work must be performed under a subcontract arrangement with a place of performance designated as FPO, ZIP 96675, under the NAICS code 334412 for electronic component and product manufacturing. The Solicitation is issued by the ASC Commodity Division within the Department of Defense and was posted on May 13, 2026, with a response deadline of May 21, 2026. All manufacturing activities are expected to meet rigorous defense-grade standards, ensuring reliability and performance in operational environments. The contract does not specify any set-aside provisions, indicating it is open to general subcontractor competition.
General Info
Agency
NAICS
Place of Performance
FPO, AP, 96675, USASet-Aside
Documents
This scope was carved out of SPE4A6-26-T-54W3.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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