This Government Contract opportunity from Department Of Defense was posted on June 25, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Component Lead Finish Identification and Marking

Closed

Federal

Submission Closed07/06/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334419

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Solicitation # SPE7M5-27-T-1653

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AI Contract Overview

The contract requires precise marking of microcircuit units in compliance with IPC/JEDEC J-STD-609 standards to clearly identify lead finish attributes such as lead-containing and lead-free configurations, along with other specified characteristics on each unit pack. The marking must adhere strictly to the detailed requirements outlined in paragraphs 5.3.1, 5.3.2, and 6.2 to ensure accurate and consistent identification across all components. This task is critical for supply chain integrity, regulatory compliance, and end-use application safety in defense and aerospace systems. Issued as a subcontract under a Total Small Business Set-Aside, this solicitation is exclusively available to small businesses as defined by the SBA and falls under NAICS code 334419 for other electronic component manufacturing. The solicitation was posted on June 25, 2026, with a response deadline of July 6, 2026, and the performance location is specified as Columbus, Ohio, with a zip code of 43213. The contracting activity originates from the Active Devices Division within the Department of Defense, emphasizing the defense-critical nature of the work and the requirement for high-precision, standards-driven marking processes.

General Info

Small business subcontract for defense-grade microcircuit marking per IPC/JEDEC standards in Columbus, Ohio.

Agency

Department Of Defense → ACTIVE DEVICES DIVISION

NAICS

334419 - Other Electronic Component Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

SBA

Documents

This scope was carved out of SPE7M5-26-T-281Z.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, LINEAR

AI Contract Breakdown

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Timeline

PhaseClosed

PostedJun 25

subcontract

Response DeadlineJul 6

Deadline has passed

Submission Closed

07/06/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Precision marking of microcircuit units per IPC/JEDEC J-STD-609 to identify Pb, Pb-Free, and other attributes on each unit pack as specified in paragraphs 5.3.1, 5.3.2, and 6.2.