COVER, SEMICONDUCTOR
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This contract pertains to the procurement of two semiconductor covers, identified by NSN 5961-01-550-4379 and part number 306-0271, under solicitation SPE7M5-26-T-400C. Delivery is required within five days of contract award, with FOB origin terms and inspection and acceptance taking place at the destination. The items must comply with stringent technical and quality requirements referenced from the DLA Master List, including adherence to DLA Packaging Requirements, MIL-STD-2073-1E for packaging, and MIL-STD-129 for marking. The contractor is required to apply specific lead finish markings per IPC/JEDEC J-STD-609 to each unit package, ensuring traceability of Pb and Pb-free attributes. The product must originate from qualified suppliers listed under the Qualified Suppliers List of Distributors and Qualified Testing Suppliers List for FSC 5961 and 5962, and supply chain traceability documentation must be retained as mandated by DLA Procurement Note C03 from August 2016. The item is subject to zero variance in quantity and must be shipped via the fastest traceable means, excluding parcel post, to the designated DLA facility in Texarkana, Texas. All packaging and marking must include the special designation ZZ and comply with palletization standards specified in RP001.
General Info
Agency
NAICS
Place of Performance
7TH STREET H AVENUE, TEXARKANA, TX, 75507-5000, USSet-Aside
Timeline
Response Deadline
Organization & Contact Information
Full Description
COVER,SEMICONDUCTOR
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL INDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
MARVIN LAND SYSTEMS, INC. 064H2 P/N 306-0271
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017800037 0001 EA 2.000
NSN/MATERIAL:5961015504379
DELIVERY (IN DAYS):0005
SPE7M5-26-T-400C
SECTION B
PR: 7017800037 PRLI: 0001 CONT’D
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:10 CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:00 CUSH/DUNN THKNESS:0
UNIT CONT:A1 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
BULK BREAK POINT:
SPE7M5-26-T-400C
SECTION B
PR: 7017800037 PRLI: 0001 CONT’D
W45G18
W0MC STK REC ACCT DEPOT REDRVR
DLA LMP ZONE 1 BLDG 552 NORTH
7TH STREET H AVENUE
TEXARKANA TX 75507-5000
US
SHIP BY FASTEST TRACEABLE MEANS. DO NOT USE PARCEL POST.
FREIGHT SHIPPING ADDRESS:
W45G18
W0MC STK REC ACCT DEPOT REDRVR
DLA LMP ZONE 1 BLDG 552 NORTH
7TH STREET H AVENUE
TEXARKANA TX 75507-5000
US
MARKFOR
W45G18
W0MC STK REC ACCT DEPOT REDRVR
DLA LMP ZONE 1 BLDG 552 NORTH
7TH STREET H AVENUE
TEXARKANA TX 75507-5000
US
M/F: (TCN) W45G18621600QX
RDD:
PROJ: TP 1
SUPP ADD: W45G18 SIG: A
FOR GOVERNMENT USE ONLY: (IPD) 03
DIC: A0A DIST: ADV: 2L FC: VH
Need Ship Date:00/00/0000 Original Required Delivery Date:08/07/2026
SPE7M5-26-T-400C NSN/Part Number: 5961-01-550-4379 Quantity: 2 EA Purchase Request: 7017800037QTY: 2 Delivery: 5 days ADO
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