Custom Machined Tooling for Chip Carriers

The contract involves the design and fabrication of custom machined tooling essential for the precise handling and placement of Spectrum Semiconductor chip carriers during critical semiconductor manufacturing processes, specifically die bonding and reflow. The tooling must meet stringent precision requirements to ensure consistent, reliable operations within a high-tech manufacturing environment, with performance directly impacting yield and quality in semiconductor production. The work is to be performed at a location with zip code 20375, corresponding to the Naval Research Laboratory's facilities, and is classified as a subcontract under the NAICS code 332721, which pertains to metalForging and Stamping. The solicitation was posted on July 23, 2026, with responses due by August 7, 2026, at 7:00 PM. The contracting entity is the Department of Defense, through the Naval Research Laboratory, indicating this effort supports defense-related electronics procurement and advanced technology development. There is no set-aside designation, meaning the opportunity is open to all eligible contractors without restriction based on business size or demographic criteria. The contract is not associated with a specific point of contact in the provided data, but interested parties can access further details via the SAM.gov link for submission and compliance requirements.