Die Bonding and Vacuum Packaging System

The Naval Research Laboratory is soliciting a single integrated die bonding and vacuum packaging system under solicitation N0017326QKN05 for use at its Washington D.C. facility. The system must perform automated die attachment with placement accuracy of no more than 5 micrometers at a rate of at least 200 placements per hour, using precise force control and 0.1 micron resolution motion, and must integrate with a vacuum reflow furnace capable of achieving and maintaining a vacuum level of 100 milliTorr or less using dry pump technology. The equipment must support thermal profiles for degassing and solder reflow across a temperature range of 25 to 450°C with ±5°C precision, accommodate substrates up to 4×5 inches, and include dual-camera vision alignment, automated thermal profiling, and a safety enclosure. Optional features include formic acid delivery with neutralization, a residual gas analyzer, tooling for specific chip carriers, a water-water chiller, and process development support. The solicitation requires full compliance with Attachment 1, Specifications, with vendors explicitly marking each requirement as “Meets” or “Does Not Meet.” All submissions must be electronically delivered via email to the designated points of contact by the deadline of August 7, 2026, and must not exceed ten pages in the technical description. The contract is awarded using a Lowest Price, Technically Acceptable (LPTA) approach, with technical compliance as the sole evaluation factor and no weighting or scoring applied beyond binary acceptability. The system must be delivered six months after award and accepted at the Naval Research Laboratory’s location in Washington, D.C., under F.O.B. Destination terms where title and risk transfer only upon successful inspection by the Government. The vendor is responsible for installation, commissioning, and integration with existing facility utilities including 208V/110V power, compressed air, chilled water, and nitrogen. Mandatory regulatory compliance includes Far 52.212-1, 52.212-3, 52.212-4, and 52.212-5, along with DFARS clauses for cybersecurity protection (252.204-7008), representation of prohibited telecommunications equipment (252.204-7016 and 252.204-7017), and representation regarding compensation of former DoD