This Government Contract opportunity from Department Of Defense was posted on April 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Defense-Grade Electronics Assembly & Integration
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract entails the final assembly, integration, and testing of advanced networking components housed within a ruggedized, environmentally protected enclosure designed for deployment on military vehicles. This effort requires precise technical execution to ensure the electronics maintain full operational integrity under extreme conditions including temperature extremes, vibration, moisture, and electromagnetic interference. The work involves conforming to stringent military standards for durability, reliability, and performance in field combat environments, with all components meeting rigorous certification and quality control benchmarks. The solicitation is classified as a subcontract under NAICS code 334290, indicating it falls under Other Communications Equipment Manufacturing, and is managed by the Department of Defense through DLA Land Warren. Responses are due by May 13, 2026, and the work must be performed at an undisclosed location within the United States, though the exact place of performance is not specified. The contract is open to qualified subcontractors capable of delivering hardened electronic systems that meet exacting military specifications, with no set-aside provisions applying. Interested parties must submit their proposals through the SAM.gov portal before the deadline to be considered.
General Info
Agency
NAICS
Place of Performance
MI, USASet-Aside
Documents
This scope was carved out of SPRDL126R0091.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
COMMON ETHERNET SWI
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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