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Electronic Component and Raw Material Supply

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract entails the supply of specialized electronic components, semiconductors, and critical raw materials such as substrates and connectors essential for the manufacturing of defense-related modules. It places significant emphasis on managing obsolescence risks and overseeing long-lead items to ensure uninterrupted production timelines and program continuity. As a subcontract under the Department of Defense, administered by the Defense Logistics Agency, the procurement is governed by the NAICS code 334419, which classifies it within the broader category of other semiconductor and related device manufacturing. The contract is publicly listed with a posted date of July 13, 2026, and is accessible via the DIBBS portal, indicating its formal integration into the defense supply chain framework. While specific performance location and point of contact details are not provided, the scope clearly focuses on sustaining technological readiness through reliable and timely material delivery, with strict attention to supply chain resilience.

General Info

Supply of defense electronics components with obsolescence management under DLA, NAICS 334419, posted July 13, 2026.

NAICS

334419 - Other Electronic Component Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-6215.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

ELECTRONIC MODULE, S

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Timeline

Posted

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Supply of specialized electronic components, semiconductors, or raw materials such as substrates and connectors needed for the module’s manufacture, including obsolescence and long-lead item management.

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