This Government Contract opportunity from Department Of Defense was posted on July 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Electronic Component Manufacturing – High-Reliability Semiconductor Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract seeks the manufacture and delivery of six high-reliability defense-grade electronic components, identified by part number DAF3233A059-005 and national stock number 5998-01-619-1192, fully compliant with military standards including MIL-STD-129, DFARS, and NAVSEA 5100-003D, with strict requirements for mercury-free construction. The components must meet exacting performance and environmental specifications typical of critical defense systems, ensuring durability and reliability under operational stress. Manufacturing must adhere to small business guidelines under the SBA Total Small Business Set-Aside program, with the NAICS code 334412 designating this as a semiconductor and related electronic component manufacturing effort. The opportunity is posted under the Department of Defense’s ASC Commodities Division, with performance required at a designated location in New Cumberland, Pennsylvania, ZIP 17070-5002. Bidders must submit responses by August 5, 2026, and the solicitation is structured as a subcontract opportunity under a broader defense procurement framework. The contract emphasizes compliance with federal acquisition regulations and supply chain integrity, requiring full traceability, documentation, and adherence to defense logistics standards. All proposals must demonstrate capability in producing military-spec electronic assemblies with rigorous quality controls and certified material sourcing.
General Info
Agency
NAICS
Place of Performance
NEW CUMBERLAND, PA, 17070-5002, USASet-Aside
Documents
This scope was carved out of SPE4A6-26-T-09ZX.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
ELECTRONIC COMPONEN
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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