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Electronic Component Packaging and Preservation

Active

Federal

Response Deadline08/24/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract opportunity with the Department of Defense Active Devices Division involves the packaging, labeling, and preservation of electronic components. The work must be performed in strict compliance with MIL-STD-2073-1E and MIL-STD-129 standards to ensure all items are properly prepared for military shipment. The project is categorized under NAICS code 334419 and will be executed at Fort Carson, Colorado. Interested parties must submit their responses by August 24, 2026, following the posting date of August 11, 2026.

General Info

DoD subcontract for electronic component packaging at Fort Carson, due August 24, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

334419 - Other Electronic Component ManufacturingView NAICS

Place of Performance

FORT CARSON, CO, 80913-4104, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-404A.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

RESISTOR, CHIP, FIXED

AI Contract Breakdown

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Timeline

PostedAug 11

subcontract

Response DeadlineAug 24

Submission deadline

Response Deadline

08/24/2026, 05:00:00 PM UTCin 12 days

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ACTIVE DEVICES DIVISION

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Packaging, labeling, and preservation of electronic components in compliance with MIL-STD-2073-1E and MIL-STD-129 for military shipment.

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