This Government Contract opportunity from Department Of Defense was posted on July 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Electronic Component Packaging and Preservation Services
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The contract requires the provision of packaging and preservation services for semiconductor devices in strict compliance with MIL-STD-2073-1E standards, utilizing preservation method 41 and climate/drying class 1 to ensure protection against moisture, shock, and environmental degradation. All components must be packaged in unit containers designated as BS (Box), which are specifically chosen to maintain device integrity throughout storage and transit under demanding conditions. The work is scoped for delivery to Hill Air Force Base, Utah, with a performance location identified by the zip code 84056-5734. The contract is classified as a subcontract under NAICS code 312230 and is administered by the Active Devices Division of the Department of Defense. Interested parties must submit responses by the deadline of August 3, 2026, following the solicitation posted on July 23, 2026.
General Info
Agency
NAICS
Place of Performance
HILL AFB, UT, 84056-5734, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-341Q.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
SEM ICONDUCTOR DEVIC
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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