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Electronic Lead Assembly Manufacturing

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract, managed by the Defense Logistics Agency under the Department of Defense, focuses on the manufacture of Electronic Lead Assemblies identified by NSN 6150-01-728-5957. The scope of work involves high-precision technical processes, including wire bonding, lead frame attachment, encapsulation, and the final packaging of discrete electronic components specifically designed for use in military systems. Classified under NAICS code 334418, the project emphasizes the production of specialized electronic assemblies to meet rigorous defense standards. The contract was posted on June 29, 2026, and is centered on delivering critical hardware components necessary for the operational integrity of military electronic infrastructure.

General Info

DLA subcontract for manufacturing specialized Electronic Lead Assemblies for military electronic infrastructure.

Agency

Department Of Defense → Defense Logistics Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE4A6-25-T-92D0.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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LEAD ASSEMBLY, ELECT

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Timeline

PostedJun 29

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Defense Logistics Agency

Office AddressN/A

ContactsNo contact information available

Full Description

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Manufacture of LEAD ASSEMBLY, ELECT (NSN 6150-01-728-5957), involving precision wire bonding, lead frame attachment, encapsulation, and packaging of discrete electronic components for military systems.

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