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This Government Contract opportunity from Department Of Justice was posted on May 20, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Electronics Integration and Circuit Board Assembly

Closed
Federal

Contract Overview

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This contract involves the design of printed circuit boards (PCBs), sourcing of electronic components, and assembly of specialized electronics focused on signal processing, power management, and data transmission. These electronics are intended for use in high-speed, ruggedized sensor systems, indicating the requirement for durable and reliable performance in demanding environments. The work will be carried out as a subcontract under a total small business set-aside, aligned with the Small Business Administration regulations. The solicitation was posted on May 20, 2026, and responses are due by June 5, 2026. The contract falls under the NAICS code 334418, which pertains to printed circuit assembly manufacturing. The Department of Justice, specifically associated with the FBI, is the awarding agency, and the place of performance is Redstone Arsenal. This opportunity emphasizes supporting small businesses and focuses on advanced electronics integration to enhance sensor system capabilities.

General Info

Design, sourcing, assembly of rugged PCBs for sensor systems; FBI subcontract, small business set-aside.

Agency

Department Of Justice → Fbi-jeh

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing View NAICS

Place of Performance

Redstone Arsenal, AL, USA

Set-Aside

SBA

Documents

(0)

No documents available

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Justice → Fbi-jeh
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Justice → Fbi-jeh
Office AddressN/A
ContactsNo contact information available

Full Description

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PCB design, component sourcing, and assembly of signal processing, power, and data transmission electronics for high-speed, ruggedized sensor systems.