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Electronics Integration & Wiring Harness Assembly

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract entails the assembly and integration of embedded electronics systems into structural AI panels, focusing on the installation of sensors, data buses, and custom wiring harnesses to ensure seamless operational functionality within advanced military platforms. This effort requires precise technical execution to meet stringent reliability and performance standards expected for defense applications, with all components designed to function optimally under demanding environmental and operational conditions. The work is classified as a subcontract under the NAICS code 334418, indicating specialized electronic component manufacturing, and is managed by the Defense Logistics Agency under the Department of Defense. The contract was posted on July 21, 2026, with no specified place of performance or set-aside provisions, and performance locations or procurement details are not provided in the available data. The associated award identifier is SPE4A726P6457, and documentation can be accessed via the DIBBS portal for further administrative reference.

General Info

Assembly of embedded electronics into AI panels for military use under DLA contract SPE4A726P6457.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE4A726P6457.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

PANEL, STRUCTURAL, AI

AI Contract Breakdown

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Timeline

Posted

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Assembly and integration of embedded electronics, including sensors, data buses, and wiring harnesses into structural AI panels.

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