Embedded Thermal Architecture Integration
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The contract seeks the design and integration of advanced cooling functionality directly into structural and electronic components for aerospace and defense applications, focusing on innovations such as heat-spreading chassis and self-cooling avionics that eliminate the need for traditional cooling systems. This effort aims to enhance thermal management efficiency by embedding cooling capabilities into the physical architecture of components, reducing weight, complexity, and power demands while improving reliability in high-stress operational environments. The opportunity is structured as a subcontract under NAICS code 332320, with a submission deadline of September 30, 2026, and is sponsored by the Defense Advanced Research Projects Agency under the Department of Defense. The work will support next-generation platforms requiring compact, high-performance thermal solutions, with performance expectations centered on seamless integration, durability under extreme conditions, and compatibility with existing aerospace and defense systems. Proposers must demonstrate technical proficiency in materials science, thermal engineering, and systems integration to meet mission-critical requirements.
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