Epoxy Bonding & Adhesive Assembly (MIS-21030)
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Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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This contract pertains to the structural bonding of subassembly components using two-part epoxy adhesives in accordance with specification MIS-21030, requiring execution in a controlled clean room environment to ensure precision and cleanliness standards. The work involves precise application, curing, and quality control of adhesive bonds critical to structural integrity, necessitating trained personnel and adherence to specified material and process controls. All activities must comply with the technical requirements of MIS-21030, with emphasis on consistency, contamination prevention, and documented compliance throughout the assembly process. The contract is designated as a Small Business Set Aside under NAICS code 332999 and is issued by the Department of Defense through the W6QK Lad Contr Office. It was posted on July 31, 2026, with a response deadline of August 28, 2026, at 4:00 PM. The place of performance is designated as Chambersburg, though no specific address is provided. The solicitation is structured as a subcontract and is only eligible for small business concerns, emphasizing support for small business participation in defense-related manufacturing activities.
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Chambersburg, PA, USASet-Aside
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