This Government Contract opportunity from Department Of Defense was posted on July 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
ESD/EMI Protective Packaging and Materials Supply
Contract Overview
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AI Contract Overview
The contract calls for the supply and application of electrostatic discharge and electromagnetic interference protective packaging materials designed to meet stringent military standards for safeguarding sensitive electronic components. All materials must comply with applicable defense specifications to ensure reliable performance in high-risk environments, with strict adherence to quality control and testing protocols. The work is to be performed at a designated location in Columbus, Ohio, with delivery and application timelines aligned to operational readiness requirements. This subcontract is issued under the NAICS code 326199 and managed by the Active Devices Division within the Department of Defense. The solicitation was posted on July 23, 2026, and responses are due by August 3, 2026, with no set-aside provisions specified. Vendors are expected to demonstrate proven capability in producing ESD- and EMI-compliant packaging, with documentation of compliance likely required during bid submission. The contract is accessible via the DIBBS platform for qualified contractors seeking to participate in the procurement process.
General Info
Agency
NAICS
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-350G.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITA
AI Contract Breakdown
Uniform Contract FormatNo contract breakdown available.
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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