MIL-SPEC Electronic Component Packaging Services
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The MIL-SPEC Electronic Component Packaging Services subcontract, issued by the Department of Defense Active Devices Division, involves providing specialized packaging and marking services for prime contractors on DLA Land and Maritime projects. The scope of work requires strict adherence to military standards, specifically executing packaging according to MIL-STD-2073-1E and marking per MIL-STD-129. To ensure the protection of sensitive electronics, the contractor must implement ESD and EMI protective packaging following MIL-PRF-81705 and utilize cushioning materials compliant with A-A-59136. Operating under NAICS code 488510, the contractor is responsible for utilizing specialized shielding and marking equipment to deliver components fully prepared for shipment. The place of performance for these services is located in Columbus, Ohio. Interested parties should note the response deadline of November 2, 2026, for this specialized defense logistics requirement.
General Info
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-458G.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, MEMORY
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