Skip to main contentPsst! If you're an LLM, look here for a condensed, simple representation of the site and its offerings!

LiveFree Webinar — Wednesday, September 16 at 2:00 PM EDT

Register Free →

This Government Contract opportunity from Department Of Defense was posted on July 26, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

ESD/EMI Protective Packaging Supply and Application

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

NAICS: 326199
New
Federal
NTDP - Injection Molding - WFCS Corrosion Tests Improvements
Solicitation # 12444326Q0066
Solicitation 12444326Q0066 is a request for quotation issued by the USDA Forest Service National Technology and Development Program for injection molding services to modernize Wildland Fire Chemical Systems corrosion tests. This total small business set-aside under NAICS code 326199 requires a contractor to design, fabricate, and tool injection molds for four separate parts made from PEEK resin, transitioning them from 3D-printed proofs-of-concept to mass-produced components. The contract is structured as a firm-fixed-price purchase order featuring a one-year base period from October 1, 2026, to September 30, 2027, with three subsequent one-year option periods, extending the total duration to a maximum of four years. Deliverables include the molds, technical documentation, and batches of molded PEEK coupon dipper components, with all items shipped FOB Destination to Missoula, Montana. The government will evaluate offers based on technical approach, price, and past performance, though award will not necessarily be made to the lowest-priced offeror. To be considered responsive, bidders must provide a technical proposal, a pricing schedule for all line items, and a list of similar projects completed within the last three years. The NTDP retains unlimited rights and ownership of all produced materials, including the molds. Quotations are due by September 18, 2026, at 1700 CT, and offerors must be actively registered in SAM.gov and provide a Unique Entity Identifier.
USDA Forest Service-Spoc East

POSTED

1 day ago

DEADLINE

in 6 days

AI Contract Overview

Show more

The contract requires the supply and application of electrostatic discharge and electromagnetic interference protective packaging materials that strictly comply with MIL-PRF-81705 specifications, ensuring all materials are sourced exclusively from manufacturers listed on the Qualified Products List for this standard. The work involves providing packaging solutions that safeguard sensitive electronic components from static and electromagnetic threats during handling, storage, and transit, with full adherence to military-grade performance and quality requirements. All submissions must originate from QPL-81705 qualified vendors to guarantee compliance and consistency. The contract is structured as a subcontract under the Department of Defense’s Active Devices Division, with performance taking place in Columbus, Ohio, at ZIP code 43213. It falls under NAICS code 326199 for other plastic product manufacturing and was posted on July 26, 2026, with responses due by August 6, 2026. No specific set-aside designation is indicated, and bidders must ensure their proposals meet all technical and sourcing criteria without deviation. The solicitation is accessible through the DIBBS platform for prospective subcontractors seeking to engage in this defense-related supply effort.

General Info

Supply MIL-PRF-81705 compliant ESD/EMI packaging from QPL vendors in Columbus, Ohio for DoD.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

326199 - All Other Plastics Product ManufacturingView NAICS

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-352Q.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, DIGITAL

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

Cannot generate Contract Breakdown because no documents were found from this contract's source.

Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

Find active opportunities like this

Start your free trial to discover similar active contracts, track opportunities, and build proposals with AI assistance.

Organization & Contact Information

Show more
AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

Show more
Supply and apply ESD/EMI protective packaging materials compliant with MIL-PRF-81705 and sourced from QPL-81705 qualified manufacturers.

More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION

Same awarding agency

NAICS: 339991
New
DIBBS
GASKET, SPIRAL WOUND
Solicitation # SPE7M5-26-U-0065
Solicitation SPE7M5-26-U-0065 is a total small business set-aside for the procurement of 3,182 spiral wound gaskets, identified as critical application items under NSN 5330-00-348-9152. The Department of Defense, through the Defense Logistics Agency Active Devices Division, is seeking quotes for an indefinite delivery contract with a maximum value of 350,000 dollars. Approved part numbers include 24326-600 from Eaton Aeroquip LLC, 417-600A from V I J Corp, and BAG10X-600 from The Boeing Company. Delivery is required within 63 days after the order, with shipping terms set as FOB Origin and inspection and acceptance occurring at the destination. The contract imposes strict technical and security requirements, including the prohibition of asbestos per FED-STD-313 and compliance with the Buy American Act and Berry Amendment. Because the item contains export-controlled technical data subject to ITAR or EAR, eligible offerors must possess an approved US/Canada Joint Certification Program certification and DLA authorization. Packaging and marking must adhere to MIL-STD-2073-1E and MIL-STD-129, with palletization following RP001. Administrative requirements include the use of the Wide Area WorkFlow system for invoicing and compliance with DFARS 252.204-7012 for safeguarding covered defense information. Items produced via additive manufacturing are ineligible for award unless specifically authorized.
Gasket, Packing, and Sealing Device Manufacturing

POSTED

about 22 hours ago

DEADLINE

in 4 days
View Details
NAICS: 334413
New
DIBBS
MICROCIRCUIT, LINEAR
Solicitation # SPE7M5-26-T-453R
Solicitation SPE7M5-26-T-453R is a small business set-aside request for quotations issued by the DLA Land and Maritime Active Devices Division for the procurement of two linear microcircuits, identified as critical application items. The required hardware is part number SBF-5089Z, manufactured by Qorvo US, Inc., under NSN 5962016152779. Delivery is required within 157 days after order, with a need ship date of February 16, 2027, and a final required delivery date of April 8, 2027. The items are to be delivered FOB Origin to DLA Distribution DDWO in Columbus, Ohio, with inspection and acceptance occurring at the destination. The contract mandates strict quality and compliance standards, including CMMC Level 2 self-assessment and adherence to the Qualified Suppliers List of Distributors and Qualified Testing Suppliers List for FSC 5961 and 5962. Contractors must provide traceability documentation or test reports via DLA Land and Maritime Form 918 and receive written authorization from the contract administrator before shipping. Packaging must comply with MIL-STD-2073-1E and MIL-STD-129, featuring specific ESD and EMI protections per MIL-PRF-81705 and specialized cushioning per A-A-59136. Additionally, unit packages must be marked according to IPC/JEDEC J-STD-609 for lead finish identification. Payment will be processed electronically through the Wide Area WorkFlow system.
Semiconductor and Related Device Manufacturing

POSTED

about 22 hours ago

DEADLINE

in 4 days
View Details

Find Active Opportunities Like This

Get AI-powered intelligence on the opportunities still open

Every page of the solicitation package shredded into a compliance breakdown

AI-powered matching based on your capabilities and past performance

Competitor and incumbent history on the requirement

Automated alerts on amendments, Q&A deadlines, and award

Miguel
Hillary
Keith Deutsch
Christine

Join 650+ contractors already using CLEATUS