This Government Contract opportunity from Department Of Defense was posted on May 1, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
ESD-Sensitive Electronics Packaging
Contract Overview
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The contract requires the provision of electrostatic discharge protective packaging for microelectronic components, fully compliant with MIL-HDBK-773 and ANSI/ESD S20.20 standards. This includes the supply of conductive bags, shielding materials, and proper grounding solutions designed to safeguard sensitive electronics during handling, storage, and transport. All packaging must meet rigorous military and industry specifications to ensure consistent protection against static damage in defense-related applications. This is a subcontract opportunity posted by the Department of Defense through the U.S. Army Contracting Command at Ogden, with a response deadline of April 4, 2026. The North American Industry Classification System code 561910 indicates the work falls under other support services including packaging and labeling. The place of performance and point of contact details are not specified, but bidders must ensure their solutions align with the defense supply chain’s stringent ESD control requirements. The solicitation is open for submission through the SAM.gov platform.
General Info
Agency
NAICS
Place of Performance
UTSet-Aside
Documents
This scope was carved out of SPRHA4-26-Q-0391.
The full solicitation package (5 documents), including the RFP, is on the prime solicitation, not on this scope.
Circuit Card Assembly
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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