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This Government Contract opportunity from Department Of Defense was posted on July 30, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

ESD-Sensitive Item Protection and Packaging

Closed
Federal

Contract Overview

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The contract requires the implementation of electrostatic discharge protection measures during the packaging of sensitive electronic components, in strict compliance with MIL-HDBK-773 and ANSI/ESD S20.20 standards. These industry-recognized guidelines mandate specific procedures for handling, packaging, and transporting ESD-sensitive items to prevent damage from static electricity, ensuring the integrity and functionality of electronics throughout the supply chain. All activities must be carried out in designated environments with properly grounded workstations, static-dissipative materials, and certified personnel trained in ESD control protocols. This is a subcontract under the Department of Defense, specifically managed by the Utah Defense Logistics Agency Aviation at Ogden, with a NAICS code of 334412 indicating focus on semiconductor and related device manufacturing. The opportunity was posted on July 30, 2026, and responses are due by September 1, 2026. While the place of performance and point of contact details are not provided, the requirements emphasize adherence to federal military and industry standards for ESD control, making experience in defense electronics packaging and compliance validation critical for qualified bidders.

General Info

Implement ESD protection per MIL-HDBK-773 and ANSI/ESD S20.20 for defense semiconductor packaging.

Agency

Department Of Defense → Ut DLA Aviation At Ogden

NAICS

334412 - Bare Printed Circuit Board ManufacturingView NAICS

Place of Performance

UT

Set-Aside

NONE

Documents

This scope was carved out of SPRHA4-26-Q-0733.

The full solicitation package (3 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

F-16 CIRCUIT CARD ASSEMBLY NSN: 5998016848453WF

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Ut DLA Aviation At Ogden
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Ut DLA Aviation At Ogden
Office AddressN/A
ContactsNo contact information available

Full Description

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Implementation of electrostatic discharge (ESD) protection during packaging using MIL-HDBK-773 and ANSI/ESD S20.20 standards for sensitive electronics.

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Miguel
Hillary
Keith Deutsch
Christine

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