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This Government Contract opportunity from Department Of Defense was posted on October 6, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Flexible Printed Circuit Fabrication (Bare Board)

Closed
Federal

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This subcontract involves the fabrication of base flexible printed circuit boards for prime contractors supporting the DLA Weapons Support Strategic Acquisition Program Directorate within the Department of Defense. The scope of work includes manufacturing flexible substrates using polyimide and Kapton, etching and plating conductive paths, and applying necessary adhesives and coverlays. Additionally, the contractor is responsible for drilling and punching mounting holes in accordance with BAE Systems P/N 329543-101 and the DLA Master List of Technical and Quality Requirements. The final deliverables consist of unpopulated bare boards. This opportunity falls under NAICS code 334413 and was posted on October 6, 2026, with a response deadline of October 21, 2026.

General Info

Fabrication of base flexible printed circuit boards for DoD DLA weapons support program.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7LX-27-U-0137.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CABLE ASSEMBLY, PRINTED

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT STRATEGIC ACQ PROGRAM DIRECTORATE
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabricates base flexible printed circuit boards for prime contractors on DLA Weapons Support Strategic Acquisition Program projects. Manufactures flexible substrates using polyimide/Kapton, performs etching and plating of conductive paths, and applies coverlays and adhesives. Drills and punches mounting holes per BAE Systems P/N 329543-101 and DLA Master List of Technical and Quality Requirements. Delivers unpopulated bare boards.

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