This Government Contract opportunity from Department Of Defense was posted on July 9, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Hazardous Materials Compliance and Labeling
Contract Overview
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The contract requires strict adherence to OSHA Hazardous Communication Standard and DFARS 252.223-7001 for all semiconductor devices and packaging, ensuring full compliance with hazardous substance regulations including the restriction of mercury. All materials must be properly labeled to identify chemical hazards and safe handling procedures, with particular attention to substances covered under federal environmental and defense procurement guidelines. The work must be performed in alignment with the specified place of performance at Robins Air Force Base, Georgia, and all deliverables need to reflect rigorous documentation and certification of compliance. This is a subcontract under NAICS code 541620, issued by the Department of Defense’s Active Devices Division, with a response deadline of July 20, 2026. The solicitation is open for bids through the DIBBS platform, and contractors must demonstrate proven capability in managing hazardous material compliance within the semiconductor manufacturing and packaging supply chain. There is no set-aside designation, meaning the contract is open to all qualified entities, and all participants are expected to meet the technical and regulatory standards without exception.
General Info
Agency
NAICS
Place of Performance
ROBINS A F B, GA, 31098-1887, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-314B.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
SEMICONDUCTOR DEVIC
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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